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Three-Dimensional Integration of Silicon Chips for Automotive Applications

Published online by Cambridge University Press:  26 February 2011

Werner Weber
Werner Weber*
Affiliation:
werner.weber@infineon.com, Infineon Technologies, AIM TI MU FP, Am Campeon 1-12, Munich, 81726, Germany, +498923448470, +49892349557ß82
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Abstract

Currently, 3D integration of semiconductor chips is introduced into high-volume products. While memory and communication will be leading fields of application, automotive will require specific non-standard solutions some of which are in research or development whereas others have already been introduced to production. This paper elaborates on the different opportunities and constraints of automotive applications, presents different technological options and discusses specific solutions considered in research or found in already existing products.

Keywords

bondingpackagingthin film
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 970: Symposium Y – Enabling Technologies for 3-D Integration , 2006 , 0970-Y03-01
Copyright
Copyright © Materials Research Society 2007

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References

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