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Ternary Phase Formation in 95Pb-5Sn Flip-Chip Solder Bonds

Published online by Cambridge University Press:  15 February 2011

Alan J. Mockler ,
Peter J. Goodhew  and
Elizabeth A. Logan
Alan J. Mockler
Affiliation:
Dept. of Materials Science & Engineering, University of Liverpool, Liverpool L69 3BX, UK
Peter J. Goodhew
Affiliation:
Dept. of Materials Science & Engineering, University of Liverpool, Liverpool L69 3BX, UK
Elizabeth A. Logan
Affiliation:
GEC-Marconi Materials Technology Ltd., Caswell, Towcester, Northants NNL12 8EQ, UK
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Abstract

The microstructure of 95Pb-5Sn flip-chip solder bonds deposited on Cr/Cu/Au metallisation pads has been studied using both light and electron analysis techniques. The presence of Sn-Cu- Au ternary intermetallic phases was detected within the Pb-rich matrix at significant distances from the originally deposited interface. The distribution of the phases present after the solder has undergone a reflow heat treatment can be interpreted using recent equilibrium ternary diagram data. An investigation was also made into the effects of various non-reflow heat treatments at carefully chosen temperatures, to qualitatively evaluate the extent of solid state diffusion and the resultant phase distribution.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 131
Copyright
Copyright © Materials Research Society 1994

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References

1. Frear, D., Grivas, D. and Morris, J.W., J. Elec. Mat. 16, 181 (1987).Google Scholar
2. Karlsen, O.B., Kjekshus, A. and Rost, E., Acta Chem. Scand. 46, 147 (1992).Google Scholar
3. Munns, A., Metals and Materials, January 1989.Google Scholar
4. Jacobs, E.G., Foster, L.A., Wu, Y., Wilson, A.R. and Pinizotto, R.F., J. Mater. Res. 8 (1), (1993).Google Scholar
5. McLellan, R.B., Ko, C. and Brotzen, F.R., Acta Metall. Mater. 38, 2161 (1990).CrossRefGoogle Scholar