No CrossRef data available.
Published online by Cambridge University Press: 25 February 2011
Multicomponents silicon based ceramic thin films were prepared by ion beam irradiation of organosilicon polymer films. Our approach involved dissolving organosilicon polymers in toluene and using spinning technique to deposit the polymer films. Four organosilicon polymers were used to prepare polymer films with various thickness (2000 Å to 5000 Å). These polymer films were then irradiated with high energy ion beams, 6.0 MeV F beam, 2.0 MeV He beam, 1.0 MeV Au beam, and 50 KeV N beam. Amorphous, crack-free, hard ceramic films of up to 4000 Å may be produced in this manner. The presence and concentrations of each elememt were monitored with proton recoil detection and Auger analysis. The in-situ loss of gases was monitored by quadrupole mass spectrometry. Cross-sectional TEM was used to determine the overall homogeneity and thickness of these films. These ceramic films provide significant protection of silicon substrates from high temperature surface oxidation and chemical corrosion.