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Superlayer Residual Stress Effect on the Indentation Adhesion Measurements

Published online by Cambridge University Press:  10 February 2011

Alex A. Volinsky ,
Neville R. Moody  and
William W. Gerberich
Alex A. Volinsky
Affiliation:
University of Minnesota, Dept. of Chemical Engineering and Materials Science, Minneapolis, MN 55455, volinsky@cems.umn.edu
Neville R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
William W. Gerberich
Affiliation:
University of Minnesota, Dept. of Chemical Engineering and Materials Science, Minneapolis, MN 55455, volinsky@cems.umn.edu
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Abstract

The practical work of adhesion has been measured in thin aluminum films as a function of film thickness and residual stress. These films were sputter deposited onto thermally oxidized silicon wafers followed by sputter deposition of a one micron thick W superlayer. The superlayer deposition parameters were controlled to produce either a compressive residual stress of 1 GPa or a tensile residual stress of 100 MPa. Nanoindentation testing was then used to induce delamination and a mechanics based model for circular blister formation was used to determine practical works of adhesion. The resulting measured works of adhesion for all films between 100 nm and 1 μm thick was 30 J/m2 regardless of superlayer stress. However, films with the compressively stressed superlayers produced larger blisters than films with tensile stressed superlayers. In addition, these films were susceptible to radial cracking producing a high variability in average adhesion values.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 594: Symposium V – Thin Films - Stresses & Mechanical Properties VIII , 1999 , 383
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Tsui, T.Y., Oliver, W.C., Pharr, G.M., J. Mater. Res., 11(3), 752–759, 1996 Google Scholar
2. Bolshakov, A., Oliver, W.C., Pharr, G.M., J. Mater. Res., 11(3), 760–768, 1996 Google Scholar
3. Zagrebelny, A.V., Carter, C.B., Scripta Mater., 37(12), 1869–1875, 1997 Google Scholar
4. Zagrebelny, A.V., Carter, C.B., Philosophical Magazine A, 79(4), 835–845, 1998 Google Scholar
5. Suresh, S., Giannakopoulos, A.E., Acta Materialia, 46(16), 5755–5767, 1998 Google Scholar
6. Marshall, D.B., Evans, A.G., J. Appl. Phys. 56(10), 2632–2638, 1984 Google Scholar
7. Kriese, M.D., Gerberich, W.W., Moody, N.R., J. Mater. Res., 14(7), 3007–3018, 1998 Google Scholar
8. Oliver, W.C. and Pharr, G.M., J. Mater. Res., 7, 1564–1583, 1992 Google Scholar
9. Volinsky, A.A., Tymiak, N.I., Kriese, M.D., Gerberich, W.W., Mat. Res. Soc. Symp. Proc. 539, 277–290, 1999 Google Scholar
10. Tymiak, N.I., Volinsky, A.A., Kriese, M.D., Downs, S.A., Gerberich, W.W., accepted for publication in Metallurgical Transactions, 1999 Google Scholar
11. Stoney, G.G., Proc.Roy.Soc.Lond. A82, 72, 1909 Google Scholar
12. Thornton, J.A., Hoffman, D.W., Thin Solid Films, 171(1), 5–31, 1989 Google Scholar
13. Ohring, M., The Materials Science of Thin Films, Academic Press, 1992 Google Scholar
14. Vlassak, J.J., Drory, M.D., Nix, W.D., J. Mater. Res., 12(7), 1900–1910, 1997 Google Scholar
15. Ritchie, R.O., Cannon, R.M., Dalgleish, B.J., Dauskardt, R.H., McNaney, J.M., Mater. Sci. and Eng., A166, 221–235, 1993 Google Scholar