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A Study of Sn-Pb-Re Solder

Published online by Cambridge University Press:  15 February 2011

Zhu Ying ,
Fang Hongyuan  and
Qian Yiyu
Zhu Ying
Affiliation:
Postgraduate, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
Fang Hongyuan
Affiliation:
Associate Professor, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
Qian Yiyu
Affiliation:
Professor, Harbin Institute of Technology, Dep. of Welding, Harbin, The People's Republic of China
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Abstract

One of the important way to improve the property of solder joints is to improve the property of solders, This paper is about a study of Sn-Pb-RE solder(RE-Rear Earth, mainly contains Ce and La). It has been shown that the final form of RE in SnPb60/40 solder is Sn-RE intermetallic compound, and a very little RE can change the solder microstructure greatly. The influence of RE on solder life of creep rupture is that Sn-Pn-RE solder has much long life than that of SnPb60/40, and the solder life increases with the increase of RE content.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 137
Copyright
Copyright © Materials Research Society 1994

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References

1. Clatterbaugh, G.V., Charles, H.K.,35th Electronic Conf.,1985.Google Scholar
2. Ross, R.G., Wen, L.C., Mon, G.R., Jetter, E. and Winslow, J., Conf. of ME 1991, p. 438–438Google Scholar
3. Tien, J.K., Hendrix, B.C., Bertz, D.L., and Attarwala, A.I., 39th Electronic Conf., 1989, p. 259–262.Google Scholar
4. Devore, John A., Proe. of NEPCO' 82, 1982, p. 409–414.Google Scholar
5. Frear, D., 39th Electronic Conf.,1989.Google Scholar
6. YueQi, Yu, WenZhi, Yi, BangDi, Chen and HongJian, Cheng, Binary Phase Digrams (Shang Hai Science & Technology Publishers, Shang Hai, 1987), p.295–298.Google Scholar