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Simulations of Dislocation Dynamics in Aluminum Interconnects

Published online by Cambridge University Press:  01 February 2011

Lucia Nicola ,
Erik Van der Giessen  and
Alan Needleman
Lucia Nicola
Affiliation:
The Netherlands Institute for Metals Research/Dept. of Applied Physics, University of Groningen, Nyenborgh 4, 9747 AG Groningen, The Netherlands
Erik Van der Giessen
Affiliation:
The Netherlands Institute for Metals Research/Dept. of Applied Physics, University of Groningen, Nyenborgh 4, 9747 AG Groningen, The Netherlands
Alan Needleman
Affiliation:
Division of Engineering, Brown University, Providence, RI 02912, USA
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Abstract

A discrete dislocation simulation of plastic deformation in metallic interconnects caused by thermal stress is carried out. The calculations are carried out using a two dimensional plane strain formulation with only edge dislocations. A boundary value problem is formulated and solved for the evolution of the thermal stress field and the evolution of the dislocation structure in the cross-section of the line as cooling proceeds. For lines with a small cross section (height or width less than 1 μm), the local concentration of stresses due to dislocation patterning strongly affects the overall stress build up and relaxation. The results show a clear dependence of the transverse stress development on the line aspect ratio.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 731: Symposium W – Modeling and Numerical Simulation of Materials Behavior and Evolution , 2002 , W1.5
Copyright
Copyright © Materials Research Society 2002

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