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Simulation of Microstructural Evolution During Thermomechanical Cycling in Pb-Sn Solders

Published online by Cambridge University Press:  01 February 2011

Michael Woodmansee  and
Veena Tikare
Michael Woodmansee
Affiliation:
The Georgia Institute of Technology, The George W. Woodruff School of Mechanical Engineering, Atlanta, GA 30332-0405, U.S.A.
Veena Tikare
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185-1411, U.S.A.
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Abstract

Pb-Sn solders are known to coarsen and deform heterogeneously under shear thermomechanical cycling. Solder joint failure often occurs within these coarsened shear bands. The connection between microstructure and materials properties is well documented, which leads to the conclusion that an improved understanding of the interaction between stress and microstructural evolution will better enable the prediction of materials properties over time. In this paper, we simulate microstructural evolution of Pb-Sn solders using a novel two-phase version the Potts model, a kinetic Monte Carlo model that is coupled to a finite element mechanics model. Using this model, possible mechanisms for heterogeneous coarsening are explored.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 731: Symposium W – Modeling and Numerical Simulation of Materials Behavior and Evolution , 2002 , W6.4
Copyright
Copyright © Materials Research Society 2002

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