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Preparation and Characterization of Copper Film on PlasticSubstrate by ECR-MOCVD Coupled with a DC Bias

Published online by Cambridge University Press:  17 March 2011

Bup Ju Jeon  and
Joong Kee Lee
Bup Ju Jeon
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O.Box 131, Cheongyang Seoul 130-650, Korea
Joong Kee Lee
Affiliation:
Eco-Nano Research Center, Korea Institute of Science and Technology, P.O.Box 131, Cheongyang Seoul 130-650, Korea
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Abstract

Copper films were prepared at room temperature under a Cu(hfac)2-Ar-H2 atmosphere in order toobtainmetallized plastics by using ECR-MOCVD (Electron Cyclotron Resonance MetalOrganicChemical Vapor Deposition) coupled with a DC bias system. Structuralanalysis of the films byECR showed that fine copper grains were embedded inan amorphous plastic matrix with goodadherence. Considering the AES resultof the film prepared by ECR-CVD, we construe that thecopper film ischemically bonded with a plastic substrate. The delamination forcedetermined bythe nano-scratch tester® showed in the range from 10 to20mN.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F3.23
Copyright
Copyright © Materials Research Society 2004

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