Hostname: page-component-745bb68f8f-v2bm5 Total loading time: 0 Render date: 2025-02-11T20:35:13.996Z Has data issue: false hasContentIssue false
  • English
  • Français

The Mechanical Properties of Electroplated Cu Thin Films Measured by means of the Bulge Test Technique

Published online by Cambridge University Press:  21 March 2011

Yong Xiang ,
Xi Chen  and
Joost J. Vlassak
Yong Xiang
Affiliation:
Division of Engineering and Applied Sciences, Harvard University Cambridge, MA 02138, U.S.A.
Xi Chen
Affiliation:
Division of Engineering and Applied Sciences, Harvard University Cambridge, MA 02138, U.S.A.
Joost J. Vlassak
Affiliation:
Division of Engineering and Applied Sciences, Harvard University Cambridge, MA 02138, U.S.A.
Get access

Abstract

The mechanical properties of freestanding electroplated Cu films were determined by measuring the deflection of Si-framed, pressurized membranes. The films were deformed under plane-strain conditions. The pressure-deflection data are converted into stress-strain curves by means of simple analytical formulae. The microstructure of the Cu films was characterized using scanning electron microscopy and x-ray diffraction. The yield stress, Young's modulus, and residual stress were determined as a function of film thickness and microstructure. Both yield stress and Young's modulus increase with decreasing film thickness and correlate well with changes in the microstructure and texture of the films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L4.9.1
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Nix, W. D., Met. Trans. 20 A, 2217–45, (1989).Google Scholar
2. Keller, R-M., Baker, S. P., and Arzt, E., J. Mater. Res. 13, 1307 (1998).Google Scholar
3. Paviot, V. M., Vlassak, J. J., and Nix, W. D., Mater. Res. Symp. Proceedings 356, 579, (1995).Google Scholar
4. Vlassak, J. J., Ph.D. Thesis, Stanford University, (1994).Google Scholar
5. Vlassak, J. J., and Nix, W. D., J. Mater. Res 7, 3242, (1992).Google Scholar
6. Simmons, G. and Wang, H., Single crystal elastic constants and calculated aggregate properties: a handbook, MIT Press: Cambridge, (1971).Google Scholar
7. Dolbow, J. and Gosz, M., Mech. Mater. 23, 311, (1996).Google Scholar
8. Perez-Prado, M. T., Vlassak, J. J., to be published.Google Scholar
9. Courtney, T. H., Mechanical Behavior of Materials, McGraw-Hill, New York, 171, (1990).Google Scholar
10. Gertsman, V. Y., Hoffmann, M., Gleiter, H., and Birringer, R., Acta Metall. Mater. 42, 3539, 1994.Google Scholar
11. Baker, S. P., Kretschmann, A. and Arzt, E., Acta Mater. 49, 2145 (2001).Google Scholar