Hostname: page-component-6dbcb7884d-fw45b Total loading time: 0 Render date: 2025-02-14T06:11:06.620Z Has data issue: false hasContentIssue false
  • English
  • Français

Interfacial Strengthening in Semi-Coherent Metallic Multilayers

Published online by Cambridge University Press:  15 February 2011

S. I. Rao ,
P. M. Hazzledine  and
D. M. Dimiduk
S. I. Rao
Affiliation:
UES Inc., 4401 Dayton-Xenia Road, Dayton, OH 45432
P. M. Hazzledine
Affiliation:
UES Inc., 4401 Dayton-Xenia Road, Dayton, OH 45432
D. M. Dimiduk
Affiliation:
Wright Laboratory, WL/MLLM, Wright Patterson AFBM, OH 45433-6533
Get access

Abstract

Experimental results show that a nanolayered composite structure made of two kinds of metals strengthens dramatically as the layer thickness is reduced. In epitaxial systems, this strengthening has been attributed classically, to the modulus and lattice parameter mismatches between adjacent layers. The modulus mismatch introduces a force between a dislocation and its image in the interface. The lattice parameter mismatch generates stresses and mismatch dislocations which interact with mobile dislocations. In addition to these two interactions, there is the difficulty of operating a Frank-Read source in any very thin layer. However, the calculations suffer from the drawback that elasticity theory is being used at such short range from the dislocations that it is not strictly valid. In this paper the issues in strengthening of multilayer systems are defined within a simple analytical model. Additionally, a parametric approach using the atomistic embedded atom method (EAM), is developed to study, dislocation-interface interactions in metallic multilayers. Preliminary results of the atomistic calculations verify that Koehler strengthening is significant especially when the lamellae are very thin. For thicker lamellae the lattice parameter mismatch effects, which have been modelled within continuum theory, contribute increasingly to the strength. In Cu-Ni, the peak in the yield stress occurs when single dislocations must overcome both barriers. The yield stress drops in thicker lamellae as pile ups of increasing length form in the lamellae, finally conforming to the Hall-Petch equation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 362: Symposium J – Grain-Size and Mechanical Properties--Fundamentals and Applications , 1994 , 67
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1]. Hall, E.O., Proc. Phys. Soc. London, B64, 747, (1951).Google Scholar
[2]. Petch, N.J., J. Iron Steel Inst., 174, 25, (1953).Google Scholar
[3]. Yamaguchi, M. and Umakoshi, Y., Prog. Mat. Sci., 34,1,(1990).Google Scholar
[4]. Nakano, T., Yokoyama, A. and Umakoshi., Y., Scripta Metall. Mater, 27, 1253, (1992).Google Scholar
[5]. Bunshah, R.F., Nimmagadda, R., Doerr, H.J., Mouchan, B.A., Grechanuk, N.I. and Dabizha, E.V., Thin Solid Films, 72, 261, (1980).Google Scholar
[6]. Tench, D.M. and White, J.T., Met. Trans. 15A, 2039, (1984).Google Scholar
[7]. Menezes, S. and Anderson, D.P., J. Electrochem. Soc. 137, 440, (1990).Google Scholar
[8]. Tench, D.M. and White, J.T., J. Electrochem. Soc. 138, 3757, (1991).Google Scholar
[9]. Kim, Y.W. and Boone, S.E., private communication.Google Scholar
[10]. Van Heerden, D. and Schechtman, D., private communication.Google Scholar
[11]. Cammarata, R.C., Schlesinger, T.E., Kim, C., Qadri, S.B. and Edelstein, A.S., Appl. Phys. Letters, 56, (1990).Google Scholar
[12]. Armstrong, R.W., in Yield, Flow and Fracture of Polycrystal, edited by Baker, T.N., (Applied Science, London), p.1, (1983).Google Scholar
[13]. Koehler, J.S., Phys. Rev. B2, 547, (1970)Google Scholar
[14]. Head, A.K., Proc. Phys. Soc. London, B66, 793, (1953).Google Scholar
[15]. Pacheco, E.S. and Mura, T., J. Mech. Phys. Solids, 17, 163, (1969).Google Scholar
[16]. Fleischer, R.L., Acta Metall., 8, 598, (1960).Google Scholar
[17]. Frank, F.C. and Van der Merwe, J.H., Proc. R.Soc. London, A 198, 216, (1949).Google Scholar
[18]. Vitek, V., Crystal Lattice Defects, 5, 1, (1974).Google Scholar
[19]. Saada, G., in Electron Microscopy and Strength of Crystal. edited by Thomas, G. and Washburn, J., (Interscience, New York), p.651, (1963).Google Scholar
[20]. Mitchell, T.E., Hecker, S.S. and Smialek, R.L., Phys. Stat. Sol., 11, 585, (1965).Google Scholar
[21]. Voter, A.F., private communication.Google Scholar
[22]. Voter, A.F. and Chen, S.P., Mater. Res. Soc. Symp. Proc. 82, 175, (1990).Google Scholar
[23]. Stroh, A.N., Phil. Mag., 3, 625, (1958).Google Scholar
[24]. Simmons, J.P., to be submitted to Phil. Mag. A.Google Scholar
[25]. Parthasarathy, T.A., Dimiduk, D., Woodward, C. and Diller, D., Mater. Res. Soc. Symp. Proc., 213, 337, (1991).Google Scholar