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Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Applications

Published online by Cambridge University Press:  01 February 2011

Kun-Mo Chu ,
Jung-Hwan Choi ,
Jung-Sub Lee ,
Han Seo Cho ,
Seong-Ook Park ,
Hyo-Hoon Park  and
Duk Young Jeon
Kun-Mo Chu
Affiliation:
Dept. of Materials Sci. & Eng., Korea Advanced Institute of Science and Technology, 373–1, Kuseong-dong, Yuseong, Daejeon, 305–701, Korea
Jung-Hwan Choi
Affiliation:
Information and Communications University, Optical Interconnection and Switching Lab., 103–6 Munji-dong, Yuseong, Daejeon, 305–714, Korea
Han Seo Cho
Affiliation:
Information and Communications University, Microwave and Antenna Lab., 103–6 Munji-dong, Yuseong, Daejeon, 305–714, Korea
Seong-Ook Park
Affiliation:
Information and Communications University, Optical Interconnection and Switching Lab., 103–6 Munji-dong, Yuseong, Daejeon, 305–714, Korea
Hyo-Hoon Park
Affiliation:
Information and Communications University, Microwave and Antenna Lab., 103–6 Munji-dong, Yuseong, Daejeon, 305–714, Korea
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Abstract

We have conducted low-temperature flip-chip bonding for both optical interconnect and microwave applications. Flip-chip bonding of vertical-cavity surface-emitting laser (VCSEL) arrays was performed on a fused silica substrate that provides propagation paths of laser beams and also supports a polymeric waveguide. To avoid thermal damage of the polymeric waveguide during the flip-chip bonding, indium bumps were used and the bonding condition of the flip-chip was determined as a heating temperature of 150 °C and a pressure of 500 gf. Experimentally, a thin silver (Ag) layer coated on the indium bump was very effective to enhance the adhesion strength between the indium bump and the VCSEL chip pads. In addition, the microwave characteristic of coplanar waveguide (CPW) package was slightly improved by the Ag coating.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 833: Symposium G – Materials, Integration, and Packaging Issues for High-Frequency Devices II , 2004 , G3.1
Copyright
Copyright © Materials Research Society 2005

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References

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