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Free-standing line patterns of nanocrystallineelectrodeposits

Published online by Cambridge University Press:  17 March 2011

Karen Pantleon ,
Henrik Myhre Jensen  and
Marcel A.J. Somers
Karen Pantleon
Affiliation:
Department of Manufacturing Engineering and Management (IPL)
Henrik Myhre Jensen
Affiliation:
Department of Mechanical Engineering (MEK)
Marcel A.J. Somers
Affiliation:
Department of Manufacturing Engineering and Management (IPL)
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Abstract

Free-standing Cu- and Ni-line patterns with varying line dimensions in therange of a few micrometers were manufactured by means of electrodepositionthrough a lithographically prepared mask. XRD studies revealed for Cu-linesa pronounced influence of the pattern geometry on crystallographic textureand peak broadening. Information on the strain distribution withinindividual Cu-lines was obtained from FEM.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 812: Symposium F – Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2004 , 2004 , F3.20
Copyright
Copyright © Materials Research Society 2004

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References

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