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Fabrication of Micro-Contact Probe Using Mo-Cr Spring with Au Plating Bump

Published online by Cambridge University Press:  01 February 2011

Chinami Kaneshiro  and
Kohji Hohkawa
Chinami Kaneshiro
Affiliation:
Electric & Electrical Engineering, Kanagawa Institute of Technology, 1030 Shimo-Ogino, Atsugi-shi, Kanagawa 243–0292, JAPAN
Kohji Hohkawa
Affiliation:
Electric & Electrical Engineering, Kanagawa Institute of Technology, 1030 Shimo-Ogino, Atsugi-shi, Kanagawa 243–0292, JAPAN
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Abstract

In this paper, we report a new technology for fabricating interconnects and/or contact probes for LSI fabrication. We used a Mo-Cr spring wire as a lead wire. To reduce the resistance of the lead wire, we applied a Au plating bump to the tip of a Mo-Cr spring covered with Au thin film. Experimental results showed that contact resistance was lowered by forming an Au plating bump on the Mo-Cr spring wire, which was plated under controlled conditions.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 782: Symposium A – Micro- and Nanosystems , 2003 , A5.12
Copyright
Copyright © Materials Research Society 2004

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References

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