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The Effects of Copper on the Interfacial Failure of Gold Films

Published online by Cambridge University Press:  21 March 2011

N. R. Moody ,
D. P. Adams ,
M. J. Cordill ,
N. Yang  and
D. F. Bahr
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
D. P. Adams
Affiliation:
Sandia National Laboratories, Albuquerque, NM 87185
M. J. Cordill
Affiliation:
Washington State University, Pullman WA 99164
N. Yang
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
D. F. Bahr
Affiliation:
Washington State University, Pullman WA 99164
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Abstract

Nanoindentation test techniques were combined with deposition of highly stressed overlayers to study the interfacial fracture susceptibility of gold-on-copper and gold-2w/o-copper alloy films. The gold-on-copper film blistered readily following deposition of stressed tungsten overlayers. Additional stress from nanoindentation was required to trigger delamination and blister formation in the gold-copper alloy film. Fracture energies were then determined using mechanics-based models. The results show that the gold-copper alloy exhibited higher fracture energies than the gold-on-copper films. This increase scaled with film strength suggesting that the higher measured fracture energies in the gold-copper alloy film were due to solid solution hardening.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L7.5.1
Copyright
Copyright © Materials Research Society 2002

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