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INVESTIGATION OF INDENTATION METHODS FOR PROPERTIES DETERMINATION IN HARD FILM – SOFT SUBSTRATE SYSTEMS

Published online by Cambridge University Press:  01 February 2011

M. S. Kennedy ,
N. R. Moody  and
D. F. Bahr
M. S. Kennedy
Affiliation:
School of Mechanical and Materials Eng., Washington State University, Pullman WA 99164
N. R. Moody
Affiliation:
Sandia National Laboratories, Livermore, CA 94550
D. F. Bahr
Affiliation:
School of Mechanical and Materials Eng., Washington State University, Pullman WA 99164
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Abstract

Elastic modulus values of the thin films utilized in three different hard film- soft substrate systems were measured using a combination of traditional and continuous stiffness indentation. These systems were chosen to represent typical systems currently utilized in MEMS and included Si/SU8/W, Si/SiO2/Ti/Pt/PZT, and Si/SiO2/Ti/Pt. The last system was coated with either a compressive or nonstressed Cr film. By taking into account ratio between the creep due to the polymer substrate, SU8, to the unloading rate, the modulus of W was measured to be 400 GPa. The modulus of the SU8 was also determined to be 6 GPa. Comparing both the CSM and traditional indentation for the Si/SiO2/Ti/Pt/PZT system showed that the dynamic motion of the indenter caused pile-up in the PZT and resulting in the overestimation of the PZT modulus. This pile-up is a function of the sinusoidal loading frequency. Instead, the modulus of the PZT was measured by shallow depths of traditional indentation that resulted in the PZT modulus of 100 GPa. The hard film-soft substrate systems were show to follow the same trend as stressed soft-film hard-substrate systems with residual stress. The modulus was over estimated for compressively stressed Cr films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 841: Symposium R – Fundamentals of Nanoindentation and Nanotribology III , 2004 , R12.7
Copyright
Copyright © Materials Research Society 2005

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References

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