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Dissolution and interfacial reactions of Fe in molten Sn-Cu and Sn-Pb solders

Published online by Cambridge University Press:  31 January 2011

Yu-chih Huang ,
Sinn-wen Chen ,
Wojcieh Gierlotka ,
Chia-hua Chang  and
Jen-chin Wu
Yu-chih Huang
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan
Sinn-wen Chen
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan
Wojcieh Gierlotka
Affiliation:
Department of Chemical Engineering, National Tsing Hua University, Hsin-Chu, Taiwan; and Non-Ferrous Metals Department, AGH University of Science and Technology, 30-059 Krakow, Poland
Chia-hua Chang
Affiliation:
Chemical Systems Research Division, Chung-Shan Institute of Science and Technology, LungTan, Taiwan
Jen-chin Wu
Affiliation:
Chemical Systems Research Division, Chung-Shan Institute of Science and Technology, LungTan, Taiwan
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Abstract

Solder pots used in wave soldering are usually made using different kinds of steel. Dissolution and interfacial reactions of the Fe substrate in molten Sn-Pb and Sn-Cu solders are investigated in this study. FeSn2 phase is formed in the Sn-0.7wt%Cu/Fe couples reacted at 250, 400, and 500 °C, as well as in the Sn-37wt%Pb/Fe couples reacted at 250 and 400 °C. The activation energies of formation are 123 and 121 kJ/mol in the Sn-Cu/Fe and Sn-Pb/Fe couples, respectively. FeSn phase is the reaction product in the Sn-37wt%Pb/Fe couples reacted 500 °C. The dissolution rates of Fe in the Sn-0.7wt%Cu melt are much higher than those in-the Sn-37wt%Pb melt. The FeSn2 phase layer in the Sn-Cu/Fe couple is not as dense as that in the Sn-Pb/Fe couple and accounts for the very different dissolution rates. Detachment of the reaction FeSn2 phase into the solder matrix is observed in the Sn-Cu/Fe couples, and is a potential contaminant source in wave soldering.

Keywords

SolderingPhase equilibriaSn
Type
Articles
Information
Journal of Materials Research , Volume 22 , Issue 10 , October 2007 , pp. 2924 - 2929
Copyright
Copyright © Materials Research Society 2007

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